Armenian Journal of Physics

INCREASE IN THERMAL RELIABILITY OF INTEGRATED CIRCUITS AT THE STAGE OF PLACEMENT OF CELLS

Harutyunyan, A.G. and Kajoyan, A.H. (2008) INCREASE IN THERMAL RELIABILITY OF INTEGRATED CIRCUITS AT THE STAGE OF PLACEMENT OF CELLS. In: THE SIXTH INTERNATIONAL CONFERENCE “SEMICONDUCTOR MICRO – AND NANOELECTRONICS”, SEPTEMBER 18-20, 2007, TSAKHKADZOR, Armenia.

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Abstract

Criteria and the corresponding approach for initial placement of integral circuit cells, providing topological homogeneity of the thermal field and increase in the thermal reliability, are proposed. The developed model allows using convenient computer methods.

Item Type:Conference or Workshop Item (Paper)
Subjects:Physics > 85.Electronic and magnetic devices; microelectronics
ID Code:50
Deposited By:Prof. Vladimir Aroutiounian
Deposited On:27 Aug 2008 14:32
Last Modified:19 Apr 2011 02:40

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